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PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
Detalhes do produto:
| Lugar de origem: | China |
| Marca: | MK |
| Número do modelo: | MKSP-S630T |
Condições de Pagamento e Envio:
| Quantidade de ordem mínima: | 50 unidades |
|---|---|
| Preço: | negotiable |
| Detalhes da embalagem: | Embalagem de madeira compensada resistente com material de proteção macio adequado no interior, adeq |
| Tempo de entrega: | 10-20 dias úteis |
| Termos de pagamento: | L/C, D/A, D/P, T/T, Western Union |
| Habilidade da fonte: | 10000 metros quadrados por mês |
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Informação detalhada |
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| Matéria-prima: | Aço inoxidável SUS630T doméstico de alta qualidade | Espessura padrão: | 1.0-2.0 mm |
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| Largura máxima: | ≤ 1300 mm | Comprimento máximo: | ≤2410 mm |
| Nome do produto: | Placa de prensa de laminação PCB e CCL SUS630T | Rugosidade superficial: | Ra≤0,15μm, Rz≤1,5μm |
| Destacar: | SUS630T high-hardness lamination press plate,high-temperature resistant steel plate for PCB,corrosion resistant CCL production steel plate |
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Descrição de produto
PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate
MKSP-S630T high-precision lamination press plate utilizes premium domestic SUS630T stainless steel materials, delivering stable and reliable lamination performance with superior cost competitiveness. This specialized lamination steel plate for PCB and CCL production features exceptional thermal performance, high hardness, and outstanding corrosion resistance.
Product Advantages
SUS630T High-Hardness Lamination Press Plate | High Precision, High Temperature Resistance, Energy-Saving & Cost-Effective Solution for PCB & CCL Lamination
| Feature | Specification & Benefits |
|---|---|
| Raw Material | High-quality domestic SUS630T stainless steel with mature, stable material formula |
| Cost Performance | Reliable industrial-grade lamination quality with highly competitive pricing |
| Thermal Performance | Excellent thermal conductivity and stable thermal expansion coefficient for significant energy and cost savings |
| Material Performance | High hardness up to 50HRC±2, excellent corrosion resistance and mechanical stability |
| Equipment Compatibility | Universally compatible with all types of industrial lamination steel plate washing machines |
| Application Scenarios | Professional high-precision press plate for PCB printed circuit board and CCL copper clad laminate lamination processes |
Standard Sizes
PCB Lamination Press Plate (L × W, mm):
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm):
1910×1270, 2210×1270, 2220×1270
1910×1270, 2210×1270, 2220×1270
Detailed Performance Parameters
| Performance Parameter | Mass-Lam Plate (SUS630T) | Pin-Lam Plate (SUS630T) |
|---|---|---|
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Max Width | ≤1300mm | ≤1300mm |
| Max Length | ≤2410mm | ≤2410mm |
| Thickness Tolerance | ±0.10mm | ±0.10mm |
| Surface Roughness | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm |
| Positioning Hole Tolerance | -- | ±0.10mm |
| Standard Bushing Slot Tolerance | -- | 0 ~ +0.10mm |
| Warpage Degree | ≤3mm/M | ≤3mm/M |
| Length & Width Tolerance | ±1mm | ±1mm |
| Yield Strength | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile Strength | ≥1400 N/mm² | ≥1400 N/mm² |
| Extensibility | ≥5% | ≥5% |
| Hardness | 50HRC±2 | 50HRC±2 |
| Max Working Temperature | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03mm | ≤0.03mm |
| Diagonal Deviation | 1-2mm | 1-2mm |
| Thermal Conductivity (@300℃) | ≥18W/MK | ≥18W/MK |
| Average Thermal Expansion Coefficient | 10~12 (10⁻⁶/℃) | 10~12 (10⁻⁶/℃) |
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